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Grinding machine×日本エンギス - List of Manufacturers, Suppliers, Companies and Products

Grinding machine Product List

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Vertical Grinding Machine "HVG Series"

Vertical Grinding Machine "HVG Series"

It is optimized for small lot production and research and development institutions.

The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.

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Horizontal Grinding Machine "EHG Series"

Horizontal Grinding Machine "EHG Series"

It is possible to achieve processing efficiency and high precision flatness.

The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.

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2-axis vertical grinding machine 'HVG-200-2Axis'

2-axis vertical grinding machine 'HVG-200-2Axis'

Perform rough and precision grinding on a single work table. Suitable for small to medium lot production and research and development.

The Trinity-Y series "HVG-200-2Axis" is a grinding machine equipped with two processing axes, allowing for both rough and precision finishing on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. It is suitable for grinding hard and brittle materials and is effective for small to medium lot production and research and development. 【Features】 ■ Compact design contributes to space-saving ■ Special specifications can be provided upon request *You can view the product documentation via "PDF Download." Please feel free to contact us with any inquiries.

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2-axis vertical grinding machine 'HVG-300DSO'

2-axis vertical grinding machine 'HVG-300DSO'

Rough grinding and precision grinding performed on a single work table. Suitable for small to medium lot production and research and development.

The Trinity-Y series "HVG-300DSO" is a grinding machine equipped with a two-axis mechanism that allows for both rough and precision grinding on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. With the optional thickness measurement, the actual thickness of the wafer during processing can be measured in real-time, allowing for accurate detection of the endpoint after grinding. [Options] ■ Auto-dress mechanism ■ Thickness measurement system (available in contact and non-contact types) *You can view the product documentation via "PDF Download." Please feel free to contact us for inquiries.

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Vertical Grinding Machine "HVG-300ADM"

Vertical Grinding Machine "HVG-300ADM"

This is a grinding machine for hard and brittle materials equipped with a high-rigidity, high-precision spindle.

Engis Corporation's vertical grinding machine is a grinding system designed for hard and brittle materials, equipped with a high-rigidity and high-precision spindle (Engis HVG model). It achieves low-cost and high-precision wafer processing through semi-automatic control. Optional features include an auto-dressing mechanism for the grinding wheel, various thickness sensors for endpoint control of wafer thickness, and in-process thickness measurement technology. This equipment will be exhibited at SEMICON JAPAN 2024, held at Tokyo Big Sight from December 10 (Wednesday) to December 13 (Friday). We sincerely look forward to your visit. *Please feel free to contact us if you have any requests.

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